1. Crystallography and Product Fundamentals of Silicon Carbide
1.1 Polymorphism and Atomic Bonding in SiC
(Silicon Carbide Ceramic Plates)
Silicon carbide (SiC) is a covalent ceramic compound made up of silicon and carbon atoms in a 1:1 stoichiometric ratio, distinguished by its impressive polymorphism– over 250 recognized polytypes– all sharing solid directional covalent bonds however differing in piling series of Si-C bilayers.
One of the most technologically relevant polytypes are 3C-SiC (cubic zinc blende framework), and the hexagonal forms 4H-SiC and 6H-SiC, each displaying refined variants in bandgap, electron mobility, and thermal conductivity that influence their suitability for particular applications.
The stamina of the Si– C bond, with a bond energy of about 318 kJ/mol, underpins SiC’s amazing hardness (Mohs firmness of 9– 9.5), high melting factor (~ 2700 ° C), and resistance to chemical deterioration and thermal shock.
In ceramic plates, the polytype is normally chosen based on the planned usage: 6H-SiC prevails in structural applications because of its simplicity of synthesis, while 4H-SiC dominates in high-power electronic devices for its premium cost provider wheelchair.
The broad bandgap (2.9– 3.3 eV depending upon polytype) likewise makes SiC a superb electrical insulator in its pure kind, though it can be doped to operate as a semiconductor in specialized electronic devices.
1.2 Microstructure and Phase Purity in Ceramic Plates
The efficiency of silicon carbide ceramic plates is critically based on microstructural functions such as grain dimension, thickness, stage homogeneity, and the existence of second stages or impurities.
Top quality plates are usually made from submicron or nanoscale SiC powders through innovative sintering techniques, causing fine-grained, completely dense microstructures that maximize mechanical toughness and thermal conductivity.
Impurities such as cost-free carbon, silica (SiO TWO), or sintering help like boron or aluminum should be carefully managed, as they can create intergranular films that lower high-temperature strength and oxidation resistance.
Recurring porosity, even at low degrees (
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